| RF/Microwave PCB Manufacturing (Core Capability) |
Rapid service uses the same RF/microwave PCB processes and materials as core manufacturing, serving as an accelerated front end for standard prototype builds. |
| Metal-Backed RF/Microwave PCBs |
Eligible metal-backed prototypes can be processed through the rapid matrix when they follow the defined standard metal-backing and via structures. |
| Multilayer RF/Microwave PTFE and Mixed-Dielectric PCBs |
Rapid service supports qualifying multilayer RF structures, enabling faster turnaround of early development hardware using established multilayer processes. |
| Large Format RF/Microwave PCBs |
Where size and complexity fit standardised envelopes, large-format RF panels can be prototyped using the rapid workflow. |
| RF/Microwave PCB Assembly and Test |
Rapid bare boards can transition into Labtech’s assembly and RF test services, enabling fully built and tested microwave assemblies. |
| Thermal-Managed RF PCBs |
Thermally enhanced designs using coins, metal cores or metal-backing can be included when they remain within the rapid service’s technical criteria.
|