Post-bonded metal-backed PCBs from Teledyne Labtech offer a flexible approach to metal-backed PCBs. The RF and microwave PCB is bonded to metal backing in-house using silver-loaded conductive adhesive or non-conductive bond films, providing flexibility in material selection with robust thermal management.
Post Bonded Metal Backed PCBsPost-bonded metal-backed PCBs offer a more flexible approach to metal-backed PCBs.
Post Bonded Metal Backed PCBsPost-bonded metal-backed PCBs are printed circuit boards manufactured by Teledyne Labtech in which the RF and microwave PCB is bonded to a metal backing in-house using silver-loaded conductive adhesive or non-conductive bond films. This method offers flexibility in material selection with robust thermal management.
Teledyne Labtech offers Post Bonded Metal Backed PCBs solutions for RF and microwave applications. Key capabilities include: in-house metal bonding, silver-loaded conductive adhesive or non-conductive bond films, and flexible material selection.
- Bonding
- Silver-loaded conductive adhesive or non-conductive bond films
- Process
- In-house metal backing
- Category
- RF and microwave PCBs
Post-bonded metal-backed PCBs are used in RF applications, microwave systems, and thermally demanding designs within the electronics manufacturing industry.
